Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT
Assessment of Solder Flux Corrosivity and Flux Residue Level in Clip Bonding Assembly
Assessment of Solder Flux Corrosivity and Flux Residue Level in Clip Bonding Assembly
Fred Fuliang Le, Haibin Chen, Zunyu Guan, Francis Louise Fajardo,
Le, Fred Fuliang, Haibin Chen, Zunyu Guan, and Francis Louise Fajardo. 2021. “Assessment of Solder Flux Corrosivity and Flux Residue Level in Clip Bonding Assembly.” IMAPSource Proceedings 2021 (IMAPS Symposium): 314–20. https://doi.org/10.4071/1085-8024-2021.1.000314.