Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:40836/feed
General
Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT

Atomistic modeling to predict and improve the strength of doped Sn-Cu solder interfaces

Michael Woodcox, Manuel Smeu,
AIMDDFTInterfacesSolderStrainStress
https://doi.org/10.4071/imaps.1803272
IMAPSource Conference Papers
Woodcox, Michael, and Manuel Smeu. 2021. “Atomistic Modeling to Predict and Improve the Strength of Doped Sn-Cu Solder Interfaces.” IMAPSource Proceedings 2021 (IMAPS Symposium): 321–27. https:/​/​doi.org/​10.4071/​imaps.1803272.
Save article as...▾

View more stats

This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Powered by Scholastica, the modern academic journal management system