Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT
Atomistic modeling to predict and improve the strength of doped Sn-Cu solder interfaces
Atomistic modeling to predict and improve the strength of doped Sn-Cu solder interfaces
Michael Woodcox, Manuel Smeu,
Woodcox, Michael, and Manuel Smeu. 2021. “Atomistic Modeling to Predict and Improve the Strength of Doped Sn-Cu Solder Interfaces.” IMAPSource Proceedings 2021 (IMAPS Symposium): 321–27. https://doi.org/10.4071/imaps.1803272.