Vol. 2021, Issue 1, 2021October 01, 2021 EDT
Atomistic modeling to predict and improve the strength of doped Sn-Cu solder interfaces
Atomistic modeling to predict and improve the strength of doped Sn-Cu solder interfaces
Woodcox, Michael, and Manuel Smeu. 2021. “Atomistic Modeling to Predict and Improve the Strength of Doped Sn-Cu Solder Interfaces.” IMAPSource Proceedings 2021 (1): 321–27. https://doi.org/10.4071/imaps.1803272.
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