Low Transmission Loss Cu Wirings with Smooth Seed Layer and High Adhesion against Prepregs

Kazue Hirano; Masaya Toba; Masaki Yamaguchi

doi:10.4071/1085-8024-2021.1.000308

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Hirano, Kazue, Masaya Toba, and Masaki Yamaguchi. 2021. “Low Transmission Loss Cu Wirings with Smooth Seed Layer and High Adhesion against Prepregs.” IMAPSource Proceedings 2021 (1): 308–13. https://doi.org/10.4071/1085-8024-2021.1.000308.

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