Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT
Low Transmission Loss Cu Wirings with Smooth Seed Layer and High Adhesion against Prepregs
Low Transmission Loss Cu Wirings with Smooth Seed Layer and High Adhesion against Prepregs
Kazue Hirano, Masaya Toba, Masaki Yamaguchi,
Hirano, Kazue, Masaya Toba, and Masaki Yamaguchi. 2021. “Low Transmission Loss Cu Wirings with Smooth Seed Layer and High Adhesion against Prepregs.” IMAPSource Proceedings 2021 (IMAPS Symposium): 308–13. https://doi.org/10.4071/1085-8024-2021.1.000308.