Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT
Verification of Compartmental Electromagnetic Interference Shielding Effect with imprint-Through Mold Via (i-TMV) for RF modules
Verification of Compartmental Electromagnetic Interference Shielding Effect with imprint-Through Mold Via (i-TMV) for RF modules
Motohiro Negishi, Tomoaki Shibata, Xinrong Li, Naoya Suzuki,
Negishi, Motohiro, Tomoaki Shibata, Xinrong Li, and Naoya Suzuki. 2021. “Verification of Compartmental Electromagnetic Interference Shielding Effect with Imprint-Through Mold Via (i-TMV) for RF Modules.” IMAPSource Proceedings 2021 (IMAPS Symposium): 303–7. https://doi.org/10.4071/1085-8024-2021.1.000303.