Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT
Advanced Packaging Technology for Novel 1-dimensional and 2-dimensional VCSEL Arrays
Advanced Packaging Technology for Novel 1-dimensional and 2-dimensional VCSEL Arrays
Rainer Dohle, Gerold Henning, Maximilian Wallrodt, Christoph Gréus, Christian Neumeyr,
Dohle, Rainer, Gerold Henning, Maximilian Wallrodt, Christoph Gréus, and Christian Neumeyr. 2021. “Advanced Packaging Technology for Novel 1-Dimensional and 2-Dimensional VCSEL Arrays.” IMAPSource Proceedings 2021 (IMAPS Symposium): 265–70. https://doi.org/10.4071/1085-8024-2021.1.000265.