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Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT

Advanced Packaging Technology for Novel 1-dimensional and 2-dimensional VCSEL Arrays

Rainer Dohle, Gerold Henning, Maximilian Wallrodt, Christoph Gréus, Christian Neumeyr,
1-dimensional and 2-dimensional VCSEL arrays assembly technique SSB high reliability
• https://doi.org/10.4071/1085-8024-2021.1.000265
IMAPSource Conference Papers
Dohle, Rainer, Gerold Henning, Maximilian Wallrodt, Christoph Gréus, and Christian Neumeyr. 2021. “Advanced Packaging Technology for Novel 1-Dimensional and 2-Dimensional VCSEL Arrays.” IMAPSource Proceedings 2021 (IMAPS Symposium): 265–70. https://doi.org/10.4071/1085-8024-2021.1.000265.
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