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Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT

A Substrate-less Process for Heterogeneous Integration of mm-Wave Circuits

Cameron Crump, Yihang Chu, Premjeet Chahal,
Microwavemm-WaveAdditive Manufacturing3D Printingchiplets
https://doi.org/10.4071/1085-8024-2021.1.000224
IMAPSource Conference Papers
Crump, Cameron, Yihang Chu, and Premjeet Chahal. 2021. “A Substrate-Less Process for Heterogeneous Integration of Mm-Wave Circuits.” IMAPSource Proceedings 2021 (IMAPS Symposium): 224–27. https:/​/​doi.org/​10.4071/​1085-8024-2021.1.000224.
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