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General
Vol. 2021, Issue IMAPS Symposium, 2021
October 01, 2021 EDT
A Substrate-less Process for Heterogeneous Integration of mm-Wave Circuits
Cameron Crump
,
Yihang Chu
,
Premjeet Chahal
,
Microwave
mm-Wave
Additive Manufacturing
3D Printing
chiplets
•
https://doi.org/10.4071/1085-8024-2021.1.000224
IMAPSource Conference Papers
Crump, Cameron, Yihang Chu, and Premjeet Chahal. 2021. “A Substrate-Less Process for Heterogeneous Integration of Mm-Wave Circuits.”
IMAPSource Proceedings
2021 (IMAPS Symposium): 224–27.
https://doi.org/10.4071/1085-8024-2021.1.000224
.
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