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General
Vol. 2021, Issue 1, 2021
October 01, 2021 EDT
JEDEC’s Generation of Wire Bond Pull Test Methods to Address Pulling of Copper Wire Bonds
Curtis Grosskopf
,
Ball bond pull
copper wire
JEDEC
stitch bond pull
wire bond pull test method
•
https://doi.org/10.4071/1085-8024-2021.1.000249
IMAPSource Conference Papers
Grosskopf, Curtis. 2021. “JEDEC’s Generation of Wire Bond Pull Test Methods to Address Pulling of Copper Wire Bonds.”
IMAPSource Proceedings
2021 (1): 249–55.
https://doi.org/10.4071/1085-8024-2021.1.000249
.
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