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Vol. 2021, Issue 1, 2021October 01, 2021 EDT

JEDEC’s Generation of Wire Bond Pull Test Methods to Address Pulling of Copper Wire Bonds

Curtis Grosskopf,
Ball bond pull copper wire JEDEC stitch bond pull wire bond pull test method
• https://doi.org/10.4071/1085-8024-2021.1.000249
IMAPSource Conference Papers
Grosskopf, Curtis. 2021. “JEDEC’s Generation of Wire Bond Pull Test Methods to Address Pulling of Copper Wire Bonds.” IMAPSource Proceedings 2021 (1): 249–55. https://doi.org/10.4071/1085-8024-2021.1.000249.
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