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Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT

Optimization of Thermal Design and Mold Flow Process for 3D SiP Structure

Yu-Hsiang Chang, Bing-Yuan Huang, Hung-Hsien Huang, Dao-Long Chen, David Tarng, CP Hung,
3D SiP (System in Package)Mold flowThermal simulationThermal design
https://doi.org/10.4071/1085-8024-2021.1.000228
IMAPSource Conference Papers
Chang, Yu-Hsiang, Bing-Yuan Huang, Hung-Hsien Huang, Dao-Long Chen, David Tarng, and CP Hung. 2021. “Optimization of Thermal Design and Mold Flow Process for 3D SiP Structure.” IMAPSource Proceedings 2021 (IMAPS Symposium): 228–33. https:/​/​doi.org/​10.4071/​1085-8024-2021.1.000228.
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