Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT
High Density Package Design Platform and Assembly Design Kit
High Density Package Design Platform and Assembly Design Kit
Chih-Yi Huang, Lihong Cao, Keng-Tuan Chang, Chen-Chao Wang,
Huang, Chih-Yi, Lihong Cao, Keng-Tuan Chang, and Chen-Chao Wang. 2021. “High Density Package Design Platform and Assembly Design Kit.” IMAPSource Proceedings 2021 (IMAPS Symposium): 234–38. https://doi.org/10.4071/1085-8024-2021.1.000234.