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Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT

Enhancing the Paste Release on 55μm pads with Water-Soluble Type 7 SAC305 Solder Paste for High Density SIP Application

B. Senthil Kumar, Zhang Rui Fen, Yam Yam, Lip Huei, Zhang HanWen, Kang Sungsig, Chan Li-San,
System-in-package (SiP)Cu pillar flip-chipT7 Solder pastePassive component
https://doi.org/10.4071/1085-8024-2021.1.000239
IMAPSource Conference Papers
Senthil Kumar, B., Zhang Rui Fen, Yam Yam, Lip Huei, Zhang HanWen, Kang Sungsig, and Chan Li-San. 2021. “Enhancing the Paste Release on 55μm Pads with Water-Soluble Type 7 SAC305 Solder Paste for High Density SIP Application.” IMAPSource Proceedings 2021 (IMAPS Symposium): 239–43. https:/​/​doi.org/​10.4071/​1085-8024-2021.1.000239.
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