Enhancing the Paste Release on 55μm pads with Water-Soluble Type 7 SAC305 Solder Paste for High Density SIP Application

B. Senthil Kumar; Zhang Rui Fen; Yam Yam; Lip Huei; Zhang HanWen; Kang Sungsig; Chan Li-San

doi:10.4071/1085-8024-2021.1.000239

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Senthil Kumar, B., Zhang Rui Fen, Yam Yam, Lip Huei, Zhang HanWen, Kang Sungsig, and Chan Li-San. 2021. “Enhancing the Paste Release on 55μm Pads with Water-Soluble Type 7 SAC305 Solder Paste for High Density SIP Application.” IMAPSource Proceedings 2021 (1): 239–43. https://doi.org/10.4071/1085-8024-2021.1.000239.

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