Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT
Enhancing the Paste Release on 55μm pads with Water-Soluble Type 7 SAC305 Solder Paste for High Density SIP Application
Enhancing the Paste Release on 55μm pads with Water-Soluble Type 7 SAC305 Solder Paste for High Density SIP Application
B. Senthil Kumar, Zhang Rui Fen, Yam Yam, Lip Huei, Zhang HanWen, Kang Sungsig, Chan Li-San,
Senthil Kumar, B., Zhang Rui Fen, Yam Yam, Lip Huei, Zhang HanWen, Kang Sungsig, and Chan Li-San. 2021. “Enhancing the Paste Release on 55μm Pads with Water-Soluble Type 7 SAC305 Solder Paste for High Density SIP Application.” IMAPSource Proceedings 2021 (IMAPS Symposium): 239–43. https://doi.org/10.4071/1085-8024-2021.1.000239.