Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT
Chiplets Heterogeneous Integration on High-Density Hybrid Substrate Using an Interconnect-Layer
Chiplets Heterogeneous Integration on High-Density Hybrid Substrate Using an Interconnect-Layer
Chia-Yu Peng, John H Lau, Cheng-Ta Ko, Paul Lee, Eagle Lin, Kai-Ming Yang, Puru Bruce Lin, Tim Xia, Leo Chang, Ning Liu, Curry Lin, Tzu Nien Lee, Jason Wang, Mike Ma, Tzyy-Jang Tseng,
Peng, Chia-Yu, John H Lau, Cheng-Ta Ko, Paul Lee, Eagle Lin, Kai-Ming Yang, Puru Bruce Lin, et al. 2021. “Chiplets Heterogeneous Integration on High-Density Hybrid Substrate Using an Interconnect-Layer.” IMAPSource Proceedings 2021 (IMAPS Symposium): 217–23. https://doi.org/10.4071/1085-8024-2021.1.000217.