Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT
Additively Manufactured Extreme Temperature Electronics Packaging
Additively Manufactured Extreme Temperature Electronics Packaging
David Shaddock, Cathleen Hoel, Nancy Stoffel, Mark Poliks, Mohammed Alhendi,
Shaddock, David, Cathleen Hoel, Nancy Stoffel, Mark Poliks, and Mohammed Alhendi. 2021. “Additively Manufactured Extreme Temperature Electronics Packaging.” IMAPSource Proceedings 2021 (IMAPS Symposium): 189–94. https://doi.org/10.4071/1085-8024-2021.1.000189.