Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT
Fine-pitch Copper Pillar Flip Chips in High Reliability Applications
Fine-pitch Copper Pillar Flip Chips in High Reliability Applications
Catherine Farnum, Kaysar Rahim,
Farnum, Catherine, and Kaysar Rahim. 2021. “Fine-Pitch Copper Pillar Flip Chips in High Reliability Applications.” IMAPSource Proceedings 2021 (IMAPS Symposium): 181–88. https://doi.org/10.4071/1085-8024-2021.1.000181.