Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

    Sorry, something went wrong. Please try your search again.
    ×

    • Articles
    • Blog posts

RSS Feed

Enter the URL below into your favorite RSS reader.

https://imapsource.org/feed
×
General
Vol. 2021, Issue 1, 2021October 01, 2021 EDT

Warpage Simulation Study by Trace Mapping Method for FCCSP with ETS Substrate

Ken Zhang, Nicholas Kao, David Lai, Yu-Po Wang,
Trace Mapping Warpage ETS Substrate
• https://doi.org/10.4071/1085-8024-2021.1.000212
IMAPSource Conference Papers
Zhang, Ken, Nicholas Kao, David Lai, and Yu-Po Wang. 2021. “Warpage Simulation Study by Trace Mapping Method for FCCSP with ETS Substrate.” IMAPSource Proceedings 2021 (1): 212–16. https://doi.org/10.4071/1085-8024-2021.1.000212.
Save article as...▾
  • PDF
  • XML
  • Citation (BibTeX)

View more stats

Powered by Scholastica, the modern academic journal management system