Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT
New approach for High Reliable & Cost-Effective Solder alloys for Automotive Applications
New approach for High Reliable & Cost-Effective Solder alloys for Automotive Applications
Sebastian Fritzsche, Manu Noe Vaidya, Peter Prenosil, Katja Stenger, Jörg Trodler, Michael Jörger,
Fritzsche, Sebastian, Manu Noe Vaidya, Peter Prenosil, Katja Stenger, Jörg Trodler, and Michael Jörger. 2021. “New Approach for High Reliable & Cost-Effective Solder Alloys for Automotive Applications.” IMAPSource Proceedings 2021 (IMAPS Symposium): 159–65. https://doi.org/10.4071/1085-8024-2021.1.000159.