Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT
Design of Coaxial TGV Substrates; Enhancing RF Via to Via Isolation
Design of Coaxial TGV Substrates; Enhancing RF Via to Via Isolation
Tim LeClair, Steve Martin,
LeClair, Tim, and Steve Martin. 2021. “Design of Coaxial TGV Substrates; Enhancing RF Via to Via Isolation.” IMAPSource Proceedings 2021 (IMAPS Symposium): 149–53. https://doi.org/10.4071/1085-8024-2021.1.000149.