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Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT

Ultra wide-band, low Loss RF substrate with high-density DC routing supporting 5G/6G flip-chip RFICs

Tim Smith, Bill Rhyne, Christopher Hatfield,
Millimeter-WaveSystem in PackageRF SubstrateAntenna in PackageFlip-Chip
https://doi.org/10.4071/1085-8024-2021.1.000201
IMAPSource Conference Papers
Smith, Tim, Bill Rhyne, and Christopher Hatfield. 2021. “Ultra Wide-Band, Low Loss RF Substrate with High-Density DC Routing Supporting 5G/6G Flip-Chip RFICs.” IMAPSource Proceedings 2021 (IMAPS Symposium): 201–6. https:/​/​doi.org/​10.4071/​1085-8024-2021.1.000201.
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