Ultra wide-band, low Loss RF substrate with high-density DC routing supporting 5G/6G flip-chip RFICs

Tim Smith; Bill Rhyne; Christopher Hatfield

doi:10.4071/1085-8024-2021.1.000201

Loading [Contrib]/a11y/accessibility-menu.js

Smith, Tim, Bill Rhyne, and Christopher Hatfield. 2021. “Ultra Wide-Band, Low Loss RF Substrate with High-Density DC Routing Supporting 5G/6G Flip-Chip RFICs.” IMAPSource Proceedings 2021 (1): 201–6. https://doi.org/10.4071/1085-8024-2021.1.000201.

View more stats