ISSN 2380-4505
Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT
Ultra wide-band, low Loss RF substrate with high-density DC routing supporting 5G/6G flip-chip RFICs
Ultra wide-band, low Loss RF substrate with high-density DC routing supporting 5G/6G flip-chip RFICs
Tim Smith, Bill Rhyne, Christopher Hatfield,
Smith, Tim, Bill Rhyne, and Christopher Hatfield. 2021. “Ultra Wide-Band, Low Loss RF Substrate with High-Density DC Routing Supporting 5G/6G Flip-Chip RFICs.” IMAPSource Proceedings 2021 (IMAPS Symposium): 201–6. https://doi.org/10.4071/1085-8024-2021.1.000201.