Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT
Effect of Novel SAC-Bi Solder Joints on Electromigration Reliability for Wafer Level Chip Scale Packages
Effect of Novel SAC-Bi Solder Joints on Electromigration Reliability for Wafer Level Chip Scale Packages
Min-Yan Tsai, Yung-Sheng Lin, Chin-Li Kao, Shan-Bo Wang, Ting-Chun Lin, Yun-Ching Hung,
Tsai, Min-Yan, Yung-Sheng Lin, Chin-Li Kao, Shan-Bo Wang, Ting-Chun Lin, and Yun-Ching Hung. 2021. “Effect of Novel SAC-Bi Solder Joints on Electromigration Reliability for Wafer Level Chip Scale Packages.” IMAPSource Proceedings 2021 (IMAPS Symposium): 136–41. https://doi.org/10.4071/1085-8024-2021.1.000136.