Effect of Novel SAC-Bi Solder Joints on Electromigration Reliability for Wafer Level Chip Scale Packages

Min-Yan Tsai; Yung-Sheng Lin; Chin-Li Kao; Shan-Bo Wang; Ting-Chun Lin; Yun-Ching Hung

doi:10.4071/1085-8024-2021.1.000136

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Tsai, Min-Yan, Yung-Sheng Lin, Chin-Li Kao, Shan-Bo Wang, Ting-Chun Lin, and Yun-Ching Hung. 2021. “Effect of Novel SAC-Bi Solder Joints on Electromigration Reliability for Wafer Level Chip Scale Packages.” IMAPSource Proceedings 2021 (1): 136–41. https://doi.org/10.4071/1085-8024-2021.1.000136.

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