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General
Vol. 2021, Issue 1, 2021
October 01, 2021 EDT
Effect of Novel SAC-Bi Solder Joints on Electromigration Reliability for Wafer Level Chip Scale Packages
Min-Yan Tsai
,
Yung-Sheng Lin
,
Chin-Li Kao
,
Shan-Bo Wang
,
Ting-Chun Lin
,
Yun-Ching Hung
,
Electromigration Test
Microstructure
SAC Alloys
WLCSP
•
https://doi.org/10.4071/1085-8024-2021.1.000136
IMAPSource Conference Papers
Tsai, Min-Yan, Yung-Sheng Lin, Chin-Li Kao, Shan-Bo Wang, Ting-Chun Lin, and Yun-Ching Hung. 2021. “Effect of Novel SAC-Bi Solder Joints on Electromigration Reliability for Wafer Level Chip Scale Packages.”
IMAPSource Proceedings
2021 (1): 136–41.
https://doi.org/10.4071/1085-8024-2021.1.000136
.
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