Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT
Reliability of Chiplets Heterogeneous Integration on 2.3D Hybrid Substrate Using Solder Joint and Underfill
Reliability of Chiplets Heterogeneous Integration on 2.3D Hybrid Substrate Using Solder Joint and Underfill
Ricky Tsun-Sheng Chou, John H Lau, Gary Chang-Fu Chen, Jones Yu-Cheng Huang, Channing Cheng-Lin Yang, Hsing-Ning Liu, Tzyy-Jang Tseng,
Chou, Ricky Tsun-Sheng, John H Lau, Gary Chang-Fu Chen, Jones Yu-Cheng Huang, Channing Cheng-Lin Yang, Hsing-Ning Liu, and Tzyy-Jang Tseng. 2021. “Reliability of Chiplets Heterogeneous Integration on 2.3D Hybrid Substrate Using Solder Joint and Underfill.” IMAPSource Proceedings 2021 (IMAPS Symposium): 124–29. https://doi.org/10.4071/1085-8024-2021.1.000124.