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General
Vol. 2021, Issue 1, 2021
October 01, 2021 EDT
High UV Transmission Glass Carriers for Advanced Packaging
Jay Zhang
,
Indy Dutta
,
Julia Brueckner
,
Katsumi Bono
,
Incorporated Corning
,
Temporary bonding
glass carrier wafer
UV transmission
wafer thinning
•
https://doi.org/10.4071/1085-8024-2021.1.000103
IMAPSource Conference Papers
Zhang, Jay, Indy Dutta, Julia Brueckner, Katsumi Bono, and Incorporated Corning. 2021. “High UV Transmission Glass Carriers for Advanced Packaging.”
IMAPSource Proceedings
2021 (1): 103–7.
https://doi.org/10.4071/1085-8024-2021.1.000103
.
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