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Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT

Numerical simulation on the warpage of reconstructed wafer during encapsulation process

Hu Zhen, Zhao Wei, Gu Xiao, Chen Dong, Chen Haijie, Xu Hong, Kim Hwee Tan,
Laminationwafer reconwarpagenumerical simulation
https://doi.org/10.4071/1085-8024-2021.1.000112
IMAPSource Conference Papers
Zhen, Hu, Zhao Wei, Gu Xiao, Chen Dong, Chen Haijie, Xu Hong, and Kim Hwee Tan. 2021. “Numerical Simulation on the Warpage of Reconstructed Wafer during Encapsulation Process.” IMAPSource Proceedings 2021 (IMAPS Symposium): 112–18. https:/​/​doi.org/​10.4071/​1085-8024-2021.1.000112.
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