Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT
Numerical simulation on the warpage of reconstructed wafer during encapsulation process
Numerical simulation on the warpage of reconstructed wafer during encapsulation process
Hu Zhen, Zhao Wei, Gu Xiao, Chen Dong, Chen Haijie, Xu Hong, Kim Hwee Tan,
Zhen, Hu, Zhao Wei, Gu Xiao, Chen Dong, Chen Haijie, Xu Hong, and Kim Hwee Tan. 2021. “Numerical Simulation on the Warpage of Reconstructed Wafer during Encapsulation Process.” IMAPSource Proceedings 2021 (IMAPS Symposium): 112–18. https://doi.org/10.4071/1085-8024-2021.1.000112.