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Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT

Latest technology of wafer coating material for advanced packages

Ryuji Hirosawa, Junya Kusunoki,
RDLCoating materialPositive photosensitive resinHigh resolutionLow temperature hardeningHigh insulation and heat resistance
https://doi.org/10.4071/1085-8024-2021.1.000108
IMAPSource Conference Papers
Hirosawa, Ryuji, and Junya Kusunoki. 2021. “Latest Technology of Wafer Coating Material for Advanced Packages.” IMAPSource Proceedings 2021 (IMAPS Symposium): 108–11. https:/​/​doi.org/​10.4071/​1085-8024-2021.1.000108.
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