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General
Vol. 2021, Issue IMAPS Symposium, 2021
October 01, 2021 EDT
Latest technology of wafer coating material for advanced packages
Ryuji Hirosawa
,
Junya Kusunoki
,
RDL
Coating material
Positive photosensitive resin
High resolution
Low temperature hardening
High insulation and heat resistance
•
https://doi.org/10.4071/1085-8024-2021.1.000108
IMAPSource Conference Papers
Hirosawa, Ryuji, and Junya Kusunoki. 2021. “Latest Technology of Wafer Coating Material for Advanced Packages.”
IMAPSource Proceedings
2021 (IMAPS Symposium): 108–11.
https://doi.org/10.4071/1085-8024-2021.1.000108
.
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