Latest technology of wafer coating material for advanced packages

Ryuji Hirosawa; Junya Kusunoki

doi:10.4071/1085-8024-2021.1.000108

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Hirosawa, Ryuji, and Junya Kusunoki. 2021. “Latest Technology of Wafer Coating Material for Advanced Packages.” IMAPSource Proceedings 2021 (IMAPS Symposium): 108–11. https://doi.org/10.4071/1085-8024-2021.1.000108.

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