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General
Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT

Latest technology of wafer coating material for advanced packages

Ryuji Hirosawa, Junya Kusunoki,
RDL Coating material Positive photosensitive resin High resolution Low temperature hardening High insulation and heat resistance
• https://doi.org/10.4071/1085-8024-2021.1.000108
IMAPSource Conference Papers
Hirosawa, Ryuji, and Junya Kusunoki. 2021. “Latest Technology of Wafer Coating Material for Advanced Packages.” IMAPSource Proceedings 2021 (IMAPS Symposium): 108–11. https://doi.org/10.4071/1085-8024-2021.1.000108.
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