Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT
Latest technology of wafer coating material for advanced packages
Latest technology of wafer coating material for advanced packages
Ryuji Hirosawa, Junya Kusunoki,
Hirosawa, Ryuji, and Junya Kusunoki. 2021. “Latest Technology of Wafer Coating Material for Advanced Packages.” IMAPSource Proceedings 2021 (IMAPS Symposium): 108–11. https://doi.org/10.4071/1085-8024-2021.1.000108.