Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT
State-of-the-Art and Outlooks of Chiplets Heterogeneous Integration and Hybrid Bonding
State-of-the-Art and Outlooks of Chiplets Heterogeneous Integration and Hybrid Bonding
Lau, John H. 2021. “State-of-the-Art and Outlooks of Chiplets Heterogeneous Integration and Hybrid Bonding.” IMAPSource Proceedings 2021 (IMAPS Symposium): 49–59. https://doi.org/10.4071/1085-8024-2021.1.000049.
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