ISSN 2380-4505
Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT
State-of-the-Art and Outlooks of Chiplets Heterogeneous Integration and Hybrid Bonding
State-of-the-Art and Outlooks of Chiplets Heterogeneous Integration and Hybrid Bonding
John H Lau,
Lau, John H. 2021. “State-of-the-Art and Outlooks of Chiplets Heterogeneous Integration and Hybrid Bonding.” IMAPSource Proceedings 2021 (IMAPS Symposium): 49–59. https://doi.org/10.4071/1085-8024-2021.1.000049.