Prevention of thinned wafer deformation during thermocompression bonding and multi-die stacking supported by temporary bonding materials

Alice Guerrero; Pieter Bex; Andrew M. Jones; Arthur Southard; Daojie Dong; Alain Phommahaxay; Eric Beyne

doi:10.4071/1085-8024-2021.1.000060

Loading [Contrib]/a11y/accessibility-menu.js

General

Vol. 2021, Issue 1, 2021

October 01, 2021 EDT

Prevention of thinned wafer deformation during thermocompression bonding and multi-die stacking supported by temporary bonding materials

Alice Guerrero, Pieter Bex, Andrew M. Jones, Arthur Southard, Daojie Dong, Alain Phommahaxay, Eric Beyne,

Temporary bonding material thermocompression bonding multi-die stacking thinned wafer heterogeneous packaging interconnects copper pillars bumps

• https://doi.org/10.4071/1085-8024-2021.1.000060

IMAPSource Conference Papers

Guerrero, Alice, Pieter Bex, Andrew M. Jones, Arthur Southard, Daojie Dong, Alain Phommahaxay, and Eric Beyne. 2021. “Prevention of Thinned Wafer Deformation during Thermocompression Bonding and Multi-Die Stacking Supported by Temporary Bonding Materials.” IMAPSource Proceedings 2021 (1): 60–66. https://doi.org/10.4071/1085-8024-2021.1.000060.

View more stats