Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT
Prevention of thinned wafer deformation during thermocompression bonding and multi-die stacking supported by temporary bonding materials
Prevention of thinned wafer deformation during thermocompression bonding and multi-die stacking supported by temporary bonding materials
Alice Guerrero, Pieter Bex, Andrew M. Jones, Arthur Southard, Daojie Dong, Alain Phommahaxay, Eric Beyne,
Guerrero, Alice, Pieter Bex, Andrew M. Jones, Arthur Southard, Daojie Dong, Alain Phommahaxay, and Eric Beyne. 2021. “Prevention of Thinned Wafer Deformation during Thermocompression Bonding and Multi-Die Stacking Supported by Temporary Bonding Materials.” IMAPSource Proceedings 2021 (IMAPS Symposium): 60–66. https://doi.org/10.4071/1085-8024-2021.1.000060.