Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT
Fine Line and Low Stress RDL Solition for Fan-Out Wafer Level & Panel Level Packaging
Fine Line and Low Stress RDL Solition for Fan-Out Wafer Level & Panel Level Packaging
Yoshinori Matsuura, Tatsuya Yoshida, Yukiko Komiya, Toshimi Nakamura, Takenori Yanai, Kazuhiro Okuyama, Yukiko Kitabatake, Rintaro Ishii, Katsuyuki Hayashi, Takashi Kubota, Joji Fujii,
Matsuura, Yoshinori, Tatsuya Yoshida, Yukiko Komiya, Toshimi Nakamura, Takenori Yanai, Kazuhiro Okuyama, Yukiko Kitabatake, et al. 2021. “Fine Line and Low Stress RDL Solition for Fan-Out Wafer Level & Panel Level Packaging.” IMAPSource Proceedings 2021 (IMAPS Symposium): 39–44. https://doi.org/10.4071/1085-8024-2021.1.000039.