Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT
Design Constraints and Scale Down Evolution in Advanced Semiconductor Packages
Design Constraints and Scale Down Evolution in Advanced Semiconductor Packages
Byong Jin Kim, SangHyeon Lee, JaeBeom Shim, Nam-Hee Cho, JinYoung Khim,
Kim, Byong Jin, SangHyeon Lee, JaeBeom Shim, Nam-Hee Cho, and JinYoung Khim. 2021. “Design Constraints and Scale Down Evolution in Advanced Semiconductor Packages.” IMAPSource Proceedings 2021 (IMAPS Symposium): 6–10. https://doi.org/10.4071/1085-8024-2021.1.000006.