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Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT

Photonic Debonding for Wafer-Level Packaging

Vikram Turkani, Vahid Akhavan, Kurt Schroder, Xiao Liu, Luke Prenger, Xavier Martinez,
Photonic Lift-offFlashlampTemporary Bonding and DebondingTemporary Bonding MaterialWafer-level Packaging
https://doi.org/10.4071/1085-8024-2021.1.000067
IMAPSource Conference Papers
Turkani, Vikram, Vahid Akhavan, Kurt Schroder, Xiao Liu, Luke Prenger, and Xavier Martinez. 2021. “Photonic Debonding for Wafer-Level Packaging.” IMAPSource Proceedings 2021 (IMAPS Symposium): 67–73. https:/​/​doi.org/​10.4071/​1085-8024-2021.1.000067.
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