Photonic Debonding for Wafer-Level Packaging

Vikram Turkani; Vahid Akhavan; Kurt Schroder; Xiao Liu; Luke Prenger; Xavier Martinez

doi:10.4071/1085-8024-2021.1.000067

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General

Vol. 2021, Issue IMAPS Symposium, 2021

October 01, 2021 EDT

Photonic Debonding for Wafer-Level Packaging

Vikram Turkani, Vahid Akhavan, Kurt Schroder, Xiao Liu, Luke Prenger, Xavier Martinez,

Photonic Lift-offFlashlampTemporary Bonding and DebondingTemporary Bonding MaterialWafer-level Packaging

https://doi.org/10.4071/1085-8024-2021.1.000067

IMAPSource Conference Papers

Turkani, Vikram, Vahid Akhavan, Kurt Schroder, Xiao Liu, Luke Prenger, and Xavier Martinez. 2021. “Photonic Debonding for Wafer-Level Packaging.” IMAPSource Proceedings 2021 (IMAPS Symposium): 67–73. https://doi.org/10.4071/1085-8024-2021.1.000067.