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General
Vol. 2021, Issue 1, 2021
October 01, 2021 EDT
Photonic Debonding for Wafer-Level Packaging
Vikram Turkani
,
Vahid Akhavan
,
Kurt Schroder
,
Xiao Liu
,
Luke Prenger
,
Xavier Martinez
,
Photonic Lift-off
Flashlamp
Temporary Bonding and Debonding
Temporary Bonding Material
Wafer-level Packaging
•
https://doi.org/10.4071/1085-8024-2021.1.000067
IMAPSource Conference Papers
Turkani, Vikram, Vahid Akhavan, Kurt Schroder, Xiao Liu, Luke Prenger, and Xavier Martinez. 2021. “Photonic Debonding for Wafer-Level Packaging.”
IMAPSource Proceedings
2021 (1): 67–73.
https://doi.org/10.4071/1085-8024-2021.1.000067
.
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