Photonic Debonding for Wafer-Level Packaging

Vikram Turkani; Vahid Akhavan; Kurt Schroder; Xiao Liu; Luke Prenger; Xavier Martinez

doi:10.4071/1085-8024-2021.1.000067

Loading [Contrib]/a11y/accessibility-menu.js

Turkani, Vikram, Vahid Akhavan, Kurt Schroder, Xiao Liu, Luke Prenger, and Xavier Martinez. 2021. “Photonic Debonding for Wafer-Level Packaging.” IMAPSource Proceedings 2021 (1): 67–73. https://doi.org/10.4071/1085-8024-2021.1.000067.

View more stats