Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT
MAXQFP: NXP’s new package solution for automotive application
MAXQFP: NXP’s new package solution for automotive application
Chu-Chung Stephen Lee, Tu-Anh Tran, Andrew Mawer, XS Pang, JZ Yao,
Lee, Chu-Chung Stephen, Tu-Anh Tran, Andrew Mawer, XS Pang, and JZ Yao. 2021. “MAXQFP: NXP’s New Package Solution for Automotive Application.” IMAPSource Proceedings 2021 (IMAPS Symposium): 15–20. https://doi.org/10.4071/1085-8024-2021.1.000015.