MAXQFP: NXP’s new package solution for automotive application

Chu-Chung Stephen Lee; Tu-Anh Tran; Andrew Mawer; XS Pang; JZ Yao

doi:10.4071/1085-8024-2021.1.000015

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Lee, Chu-Chung Stephen, Tu-Anh Tran, Andrew Mawer, XS Pang, and JZ Yao. 2021. “MAXQFP: NXP’s New Package Solution for Automotive Application.” IMAPSource Proceedings 2021 (IMAPS Symposium): 15–20. https://doi.org/10.4071/1085-8024-2021.1.000015.

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