Vol. 2016, Issue HiTEC, 2016May 01, 2016 EDT
Increased High-Temperature IC Packaging Reliability Using Die Extraction and Additive Manufacturing Assembly
Increased High-Temperature IC Packaging Reliability Using Die Extraction and Additive Manufacturing Assembly
Erick M. Spory,
Spory, Erick M. 2016. “Increased High-Temperature IC Packaging Reliability Using Die Extraction and Additive Manufacturing Assembly.” IMAPSource Proceedings 2016 (HiTEC): 18–22. https://doi.org/10.4071/2016-HITEC-18.