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High Temperature Conference Papers
Vol. 2016, Issue HiTEC, 2016
May 01, 2016 EDT
Toward Interpreting Failure in Sintered-Silver Interconnection Systems†
M. C. Modugno
,
A. A. Wereszczak
,
S. B. Waters
,
Packaging & Processing
sintered silver
ceramic substrate
stencil printing
screen printing
•
https://doi.org/10.4071/2016-HITEC-234
IMAPSource Conference Papers
Modugno, M. C., A. A. Wereszczak, and S. B. Waters. 2016. “Toward Interpreting Failure in Sintered-Silver Interconnection Systems†.”
IMAPSource Proceedings
2016 (HiTEC): 234–41.
https://doi.org/10.4071/2016-HITEC-234
.
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