Flip-chip Bonded SiC Power Devices on a Low Temperature Co-fired Ceramic (LTCC) Substrate for Next Generation Power Modules

Sayan Seal; Michael D. Glover; H. Alan Mantooth

doi:10.4071/2016-HITEC-159

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Seal, Sayan, Michael D. Glover, and H. Alan Mantooth. 2016. “Flip-Chip Bonded SiC Power Devices on a Low Temperature Co-Fired Ceramic (LTCC) Substrate for Next Generation Power Modules.” IMAPSource Proceedings 2016 (HiTEC): 159–68. https://doi.org/10.4071/2016-HITEC-159.

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