Vol. 2016, Issue HiTEC, 2016May 01, 2016 EDT
Flip-chip Bonded SiC Power Devices on a Low Temperature Co-fired Ceramic (LTCC) Substrate for Next Generation Power Modules
Flip-chip Bonded SiC Power Devices on a Low Temperature Co-fired Ceramic (LTCC) Substrate for Next Generation Power Modules
Sayan Seal, Michael D. Glover, H. Alan Mantooth,
Seal, Sayan, Michael D. Glover, and H. Alan Mantooth. 2016. “Flip-Chip Bonded SiC Power Devices on a Low Temperature Co-Fired Ceramic (LTCC) Substrate for Next Generation Power Modules.” IMAPSource Proceedings 2016 (HiTEC): 159–68. https://doi.org/10.4071/2016-HITEC-159.