Development of BiAgX® HT Solder Paste for 200°C Application

Hongwen Zhang; Jonathan Minter; Ning-Cheng Lee

doi:10.4071/2016-HITEC-128

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Zhang, Hongwen, Jonathan Minter, and Ning-Cheng Lee. 2016. “Development of BiAgX® HT Solder Paste for 200°C Application.” IMAPSource Proceedings 2016 (HiTEC): 128–33. https://doi.org/10.4071/2016-HITEC-128.

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