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High Temperature Conference Papers
Vol. 2016, Issue HiTEC, 2016
May 01, 2016 EDT
First-Order SPICE Modeling of Extreme-Temperature 4H-SiC JFET Integrated Circuits
Philip G. Neudeck
,
David J. Spry
,
Liang-Yu Chen
,
SiC
JFET
Integrated Circuit
SPICE
•
https://doi.org/10.4071/2016-HITEC-263
IMAPSource Conference Papers
Neudeck, Philip G., David J. Spry, and Liang-Yu Chen. 2016. “First-Order SPICE Modeling of Extreme-Temperature 4H-SiC JFET Integrated Circuits.”
IMAPSource Proceedings
2016 (HiTEC): 263–71.
https://doi.org/10.4071/2016-HITEC-263
.
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