Vol. 2016, Issue HiTEC, 2016May 01, 2016 EDT
First-Order SPICE Modeling of Extreme-Temperature 4H-SiC JFET Integrated Circuits
First-Order SPICE Modeling of Extreme-Temperature 4H-SiC JFET Integrated Circuits
Neudeck, Philip G., David J. Spry, and Liang-Yu Chen. 2016. “First-Order SPICE Modeling of Extreme-Temperature 4H-SiC JFET Integrated Circuits.” IMAPSource Proceedings 2016 (HiTEC): 263–71. https://doi.org/10.4071/2016-HITEC-263.
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