Vol. 2016, Issue HiTEC, 2016May 01, 2016 EDT
High Temperature Potting Materials for Wire Bond Encapsulation
High Temperature Potting Materials for Wire Bond Encapsulation
David Shaddock, Liang Yin,
Shaddock, David, and Liang Yin. 2016. “High Temperature Potting Materials for Wire Bond Encapsulation.” IMAPSource Proceedings 2016 (HiTEC): 61–65. https://doi.org/10.4071/2016-HITEC-61.