High Temperature Potting Materials for Wire Bond Encapsulation

David Shaddock; Liang Yin

doi:10.4071/2016-HITEC-61

Loading [Contrib]/a11y/accessibility-menu.js

Shaddock, David, and Liang Yin. 2016. “High Temperature Potting Materials for Wire Bond Encapsulation.” IMAPSource Proceedings 2016 (HiTEC): 61–65. https://doi.org/10.4071/2016-HITEC-61.

View more stats