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High Temperature Conference Papers
Vol. 2016, Issue HiTEC, 2016May 01, 2016 EDT

Component Attachment with Pressureless Sintering for 300°C Applications

Fang Yu, Jinzi Cui, Zhangming Zhou, R. Wayne Johnson, Michael C. Hamilton,
High temperature operationresistor attachsintered Agreliability
https://doi.org/10.4071/2016-HITEC-226
IMAPSource Conference Papers
Yu, Fang, Jinzi Cui, Zhangming Zhou, R. Wayne Johnson, and Michael C. Hamilton. 2016. “Component Attachment with Pressureless Sintering for 300°C Applications.” IMAPSource Proceedings 2016 (HiTEC): 226–33. https:/​/​doi.org/​10.4071/​2016-HITEC-226.
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