Vol. 2016, Issue HiTEC, 2016May 01, 2016 EDT
Component Attachment with Pressureless Sintering for 300°C Applications
Component Attachment with Pressureless Sintering for 300°C Applications
Fang Yu, Jinzi Cui, Zhangming Zhou, R. Wayne Johnson, Michael C. Hamilton,
Yu, Fang, Jinzi Cui, Zhangming Zhou, R. Wayne Johnson, and Michael C. Hamilton. 2016. “Component Attachment with Pressureless Sintering for 300°C Applications.” IMAPSource Proceedings 2016 (HiTEC): 226–33. https://doi.org/10.4071/2016-HITEC-226.