Effect of isothermal aging at 250 °C on shear strength of joints using Au nanoporous bonding for die attach

H. Nishikawa; K. Matsunaga; M-S. Kim; M. Saito; J. Mizuno

doi:10.4071/2016-HITEC-143

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Nishikawa, H., K. Matsunaga, M-S. Kim, M. Saito, and J. Mizuno. 2016. “Effect of Isothermal Aging at 250 °C on Shear Strength of Joints Using Au Nanoporous Bonding for Die Attach.” IMAPSource Proceedings 2016 (HiTEC): 143–47. https://doi.org/10.4071/2016-HITEC-143.

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