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High Temperature Conference Papers
Vol. 2016, Issue HiTEC, 2016
May 01, 2016 EDT
Silver Sintering Paste Rendering Low Porosity Joint for High Power Die Attach Application
Sihai Chen
,
Christine LaBarbera
,
Ning-Cheng Lee
,
Silver sintering paste
die-attach
porosity
reliability
high temperature aging
temperature cycling
•
https://doi.org/10.4071/2016-HITEC-134
IMAPSource Conference Papers
Chen, Sihai, Christine LaBarbera, and Ning-Cheng Lee. 2016. “Silver Sintering Paste Rendering Low Porosity Joint for High Power Die Attach Application.”
IMAPSource Proceedings
2016 (HiTEC): 134–42.
https://doi.org/10.4071/2016-HITEC-134
.
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