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High Temperature Conference Papers
Vol. 2016, Issue HiTEC, 2016
May 01, 2016 EDT
Method to Determine Maximum Allowable Sinterable Silver Interconnect Size
A. A. Wereszczak
,
M. C. Modugno
,
S. B. Waters
,
D. J. DeVoto
,
P. P. Paret
,
silver
sintering
interconnection
residual stress
coefficient of thermal expansion
•
https://doi.org/10.4071/2016-HITEC-207
IMAPSource Conference Papers
Wereszczak, A. A., M. C. Modugno, S. B. Waters, D. J. DeVoto, and P. P. Paret. 2016. “Method to Determine Maximum Allowable Sinterable Silver Interconnect Size.”
IMAPSource Proceedings
2016 (HiTEC): 207–15.
https://doi.org/10.4071/2016-HITEC-207
.
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