Vol. 2016, Issue HiTEC, 2016May 01, 2016 EDT
Towards High Temperature Electronic Modules in which all Components would be attached using Silver Sintering
Towards High Temperature Electronic Modules in which all Components would be attached using Silver Sintering
Thomas GEOFFROY, Jean-Christophe RIOU, Yves BIENVENU, Corinne PONS, Sylvain MEILLE, Eric BAILLY,
GEOFFROY, Thomas, Jean-Christophe RIOU, Yves BIENVENU, Corinne PONS, Sylvain MEILLE, and Eric BAILLY. 2016. “Towards High Temperature Electronic Modules in Which All Components Would Be Attached Using Silver Sintering.” IMAPSource Proceedings 2016 (HiTEC): 216–25. https://doi.org/10.4071/2016-HITEC-216.