Decapsulation of Plastic Encapsulated Microelectronics with Copper Wire Bonds

Subramani Manoharan; Chandradip Patel; Patrick McCluskey

doi:10.4071/2016-HITEC-92

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Manoharan, Subramani, Chandradip Patel, and Patrick McCluskey. 2016. “Decapsulation of Plastic Encapsulated Microelectronics with Copper Wire Bonds.” IMAPSource Proceedings 2016 (HiTEC): 92–96. https://doi.org/10.4071/2016-HITEC-92.

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