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High Temperature Conference Papers
Vol. 2016, Issue HiTEC, 2016
May 01, 2016 EDT
Decapsulation of Plastic Encapsulated Microelectronics with Copper Wire Bonds
Subramani Manoharan
,
Chandradip Patel
,
Patrick McCluskey
,
Copper wirebond
decapsulation
electrolysis
failure analysis
bond shear strength
•
https://doi.org/10.4071/2016-HITEC-92
IMAPSource Conference Papers
Manoharan, Subramani, Chandradip Patel, and Patrick McCluskey. 2016. “Decapsulation of Plastic Encapsulated Microelectronics with Copper Wire Bonds.”
IMAPSource Proceedings
2016 (HiTEC): 92–96.
https://doi.org/10.4071/2016-HITEC-92
.
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