Vol. 2016, Issue HiTEC, 2016May 01, 2016 EDT
Decapsulation of Plastic Encapsulated Microelectronics with Copper Wire Bonds
Decapsulation of Plastic Encapsulated Microelectronics with Copper Wire Bonds
Subramani Manoharan, Chandradip Patel, Patrick McCluskey,
Manoharan, Subramani, Chandradip Patel, and Patrick McCluskey. 2016. “Decapsulation of Plastic Encapsulated Microelectronics with Copper Wire Bonds.” IMAPSource Proceedings 2016 (HiTEC): 92–96. https://doi.org/10.4071/2016-HITEC-92.