Developments for Copper-Graphite Composite Thermal Cores for PCBs for High-Reliability and High-Temperature RF Systems

David L. Saums; Robert A. Hay

doi:10.4071/2016-HITEC-73

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Saums, David L., and Robert A. Hay. 2016. “Developments for Copper-Graphite Composite Thermal Cores for PCBs for High-Reliability and High-Temperature RF Systems.” IMAPSource Proceedings 2016 (HiTEC): 73–78. https://doi.org/10.4071/2016-HITEC-73.

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