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High Temperature Conference Papers
Vol. 2016, Issue HiTEC, 2016
May 01, 2016 EDT
Developments for Copper-Graphite Composite Thermal Cores for PCBs for High-Reliability and High-Temperature RF Systems
David L. Saums
,
Robert A. Hay
,
copper-graphite
thermal core
PCB
printed circuit board
high temperature
high reliability
RF
•
https://doi.org/10.4071/2016-HITEC-73
IMAPSource Conference Papers
Saums, David L., and Robert A. Hay. 2016. “Developments for Copper-Graphite Composite Thermal Cores for PCBs for High-Reliability and High-Temperature RF Systems.”
IMAPSource Proceedings
2016 (HiTEC): 73–78.
https://doi.org/10.4071/2016-HITEC-73
.
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