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High Temperature Conference Papers
Vol. 2016, Issue HiTEC, 2016May 01, 2016 EDT

Developments for Copper-Graphite Composite Thermal Cores for PCBs for High-Reliability and High-Temperature RF Systems

David L. Saums, Robert A. Hay,
copper-graphite thermal core PCB printed circuit board high temperature high reliability RF
• https://doi.org/10.4071/2016-HITEC-73
IMAPSource Conference Papers
Saums, David L., and Robert A. Hay. 2016. “Developments for Copper-Graphite Composite Thermal Cores for PCBs for High-Reliability and High-Temperature RF Systems.” IMAPSource Proceedings 2016 (HiTEC): 73–78. https://doi.org/10.4071/2016-HITEC-73.
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