Vol. 2016, Issue HiTEC, 2016May 01, 2016 EDT
Developments for Copper-Graphite Composite Thermal Cores for PCBs for High-Reliability and High-Temperature RF Systems
Developments for Copper-Graphite Composite Thermal Cores for PCBs for High-Reliability and High-Temperature RF Systems
David L. Saums, Robert A. Hay,
Saums, David L., and Robert A. Hay. 2016. “Developments for Copper-Graphite Composite Thermal Cores for PCBs for High-Reliability and High-Temperature RF Systems.” IMAPSource Proceedings 2016 (HiTEC): 73–78. https://doi.org/10.4071/2016-HITEC-73.