Vol. 2016, Issue CICMT, 2016May 01, 2016 EDT
A Unified ASIC and LTCC Module Design Kit for High-Temperature High-Density Circuits
A Unified ASIC and LTCC Module Design Kit for High-Temperature High-Density Circuits
Holmes, Jim, A. Matthew Francis, Ian Getreu, and Michael Glover. 2016. “A Unified ASIC and LTCC Module Design Kit for High-Temperature High-Density Circuits.” IMAPSource Proceedings 2016 (CICMT): 169–72. https://doi.org/10.4071/2016CICMT-WP43.
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