Vol. 2016, Issue CICMT, 2016May 01, 2016 EDT
Microwave Characterization of a Thick Film System for Hybrid Packaging Applications
Microwave Characterization of a Thick Film System for Hybrid Packaging Applications
Bradley A. Thrasher, Michael A. Skurski, Ken E. Souders, James M. Parisi,
Thrasher, Bradley A., Michael A. Skurski, Ken E. Souders, and James M. Parisi. 2016. “Microwave Characterization of a Thick Film System for Hybrid Packaging Applications.” IMAPSource Proceedings 2016 (CICMT): 203–6. https://doi.org/10.4071/2016CICMT-THA24.