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Ceramics Conference Papers
Vol. 2016, Issue CICMT, 2016May 01, 2016 EDT

The Design and Evaluation of an Integrated Wire-Bondless Power Module (IWPM) using Low Temperature Co-fired Ceramic Interposer

Sayan Seal, Michael D. Glover, H. Alan Mantooth,
High power densitysilicon carbidewire bond-less interconnects
https://doi.org/10.4071/2016CICMT-TP2B1
IMAPSource Conference Papers
Seal, Sayan, Michael D. Glover, and H. Alan Mantooth. 2016. “The Design and Evaluation of an Integrated Wire-Bondless Power Module (IWPM) Using Low Temperature Co-Fired Ceramic Interposer.” IMAPSource Proceedings 2016 (CICMT): 65–72. https:/​/​doi.org/​10.4071/​2016CICMT-TP2B1.

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