Vol. 2016, Issue CICMT, 2016May 01, 2016 EDT
Material Integration for Flexible Electronics for Energy Application Using Nanoparticulated Dense and Stress-Free Ceramic Thick Film
Material Integration for Flexible Electronics for Energy Application Using Nanoparticulated Dense and Stress-Free Ceramic Thick Film
Imanaka, Yoshihiko, Hideyuki Amada, Fumiaki Kumasaka, and Naoki Awaji. 2016. “Material Integration for Flexible Electronics for Energy Application Using Nanoparticulated Dense and Stress-Free Ceramic Thick Film.” IMAPSource Proceedings 2016 (CICMT): 153–58. https://doi.org/10.4071/2016CICMT-WP31.
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