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Ceramics Conference Papers
Vol. 2016, Issue CICMT, 2016
May 01, 2016 EDT
Material Integration for Flexible Electronics for Energy Application Using Nanoparticulated Dense and Stress-Free Ceramic Thick Film
Yoshihiko Imanaka
,
Hideyuki Amada
,
Fumiaki Kumasaka
,
Naoki Awaji
,
Nanoparticle
Material integration
Flexible electronics
•
https://doi.org/10.4071/2016CICMT-WP31
IMAPSource Conference Papers
Imanaka, Yoshihiko, Hideyuki Amada, Fumiaki Kumasaka, and Naoki Awaji. 2016. “Material Integration for Flexible Electronics for Energy Application Using Nanoparticulated Dense and Stress-Free Ceramic Thick Film.”
IMAPSource Proceedings
2016 (CICMT): 153–58.
https://doi.org/10.4071/2016CICMT-WP31
.
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