ISSN 2380-4505
Vol. 2016, Issue CICMT, 2016May 01, 2016 EDT
Material Integration for Flexible Electronics for Energy Application Using Nanoparticulated Dense and Stress-Free Ceramic Thick Film
Material Integration for Flexible Electronics for Energy Application Using Nanoparticulated Dense and Stress-Free Ceramic Thick Film
Yoshihiko Imanaka, Hideyuki Amada, Fumiaki Kumasaka, Naoki Awaji,
Imanaka, Yoshihiko, Hideyuki Amada, Fumiaki Kumasaka, and Naoki Awaji. 2016. “Material Integration for Flexible Electronics for Energy Application Using Nanoparticulated Dense and Stress-Free Ceramic Thick Film.” IMAPSource Proceedings 2016 (CICMT): 153–58. https://doi.org/10.4071/2016CICMT-WP31.