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Ceramics Conference Papers
Vol. 2016, Issue CICMT, 2016May 01, 2016 EDT

Advanced DBC - Highly Reliable and Conductive Copper Ceramic Substrates

Paul Gundel, Anton Miric, Kai Herbst, Melanie Bawohl, Jessica Reitz, Christina Modes, Gabriel Zier, Ilias Nikolaidis, Mark Challingsworth,
DBCdirect bonded coppersubstratethermal conductivitythick print copperTPC
https://doi.org/10.4071/2016CICMT-TP2B2
IMAPSource Conference Papers
Gundel, Paul, Anton Miric, Kai Herbst, Melanie Bawohl, Jessica Reitz, Christina Modes, Gabriel Zier, Ilias Nikolaidis, and Mark Challingsworth. 2016. “Advanced DBC - Highly Reliable and Conductive Copper Ceramic Substrates.” IMAPSource Proceedings 2016 (CICMT): 73–78. https:/​/​doi.org/​10.4071/​2016CICMT-TP2B2.
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