Vol. 2016, Issue DPC, 2016January 01, 2016 EDT
Stacking of 3D Capacitor Chips in a Package for a Compact and Reliable Component Working at High Temperature
Stacking of 3D Capacitor Chips in a Package for a Compact and Reliable Component Working at High Temperature
Stephan Borel, P. Descours, B. Goubault, P. Nicolas, R. Franiatte, G. Parat, M. Pommier, S. Yon, G. Simon, C. Bunel,
Borel, Stephan, P. Descours, B. Goubault, P. Nicolas, R. Franiatte, G. Parat, M. Pommier, S. Yon, G. Simon, and C. Bunel. 2016. “Stacking of 3D Capacitor Chips in a Package for a Compact and Reliable Component Working at High Temperature.” IMAPSource Proceedings 2016 (DPC): 1948–66. https://doi.org/10.4071/2016DPC-THA21.