Stacking of 3D Capacitor Chips in a Package for a Compact and Reliable Component Working at High Temperature

Stephan Borel; P. Descours; B. Goubault; P. Nicolas; R. Franiatte; G. Parat; M. Pommier; S. Yon; G. Simon; C. Bunel

doi:10.4071/2016DPC-THA21

Loading [Contrib]/a11y/accessibility-menu.js

Borel, Stephan, P. Descours, B. Goubault, P. Nicolas, R. Franiatte, G. Parat, M. Pommier, S. Yon, G. Simon, and C. Bunel. 2016. “Stacking of 3D Capacitor Chips in a Package for a Compact and Reliable Component Working at High Temperature.” IMAPSource Proceedings 2016 (DPC): 1948–66. https://doi.org/10.4071/2016DPC-THA21.

View more stats