Vol. 2016, Issue DPC, 2016January 01, 2016 EDT
Ultra Fine Pitch RDL Development in Multi-layer eWLB (embedded Wafer Level BGA) Packages
Ultra Fine Pitch RDL Development in Multi-layer eWLB (embedded Wafer Level BGA) Packages
Bernard Adams, Won Kyung Choi, Duk Ju Na, Andy Yong, Seung Wook Yoon, Jaesik Lee, Urmi Ray, Riko Radojcic,
Adams, Bernard, Won Kyung Choi, Duk Ju Na, Andy Yong, Seung Wook Yoon, Jaesik Lee, Urmi Ray, and Riko Radojcic. 2016. “Ultra Fine Pitch RDL Development in Multi-Layer eWLB (Embedded Wafer Level BGA) Packages.” IMAPSource Proceedings 2016 (DPC): 809–25. https://doi.org/10.4071/2016DPC-TP24.