Ultra Fine Pitch RDL Development in Multi-layer eWLB (embedded Wafer Level BGA) Packages

Bernard Adams; Won Kyung Choi; Duk Ju Na; Andy Yong; Seung Wook Yoon; Jaesik Lee; Urmi Ray; Riko Radojcic

doi:10.4071/2016DPC-TP24

Loading [Contrib]/a11y/accessibility-menu.js

Adams, Bernard, Won Kyung Choi, Duk Ju Na, Andy Yong, Seung Wook Yoon, Jaesik Lee, Urmi Ray, and Riko Radojcic. 2016. “Ultra Fine Pitch RDL Development in Multi-Layer eWLB (Embedded Wafer Level BGA) Packages.” IMAPSource Proceedings 2016 (DPC): 809–25. https://doi.org/10.4071/2016DPC-TP24.

View more stats