Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
Menu
Articles
Ceramics Conference Papers
Device Packaging Conference Presentations
General
High Temperature Conference Papers
IMAPS Chapter Conferences
Symposium Proceedings
All
For Authors
Editorial Board
About
Issues
Journal Micro & Elect Pkg
search
Sorry, something went wrong. Please try your search again.
×
Articles
Blog posts
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsource.org/feed
×
Device Packaging Conference Presentations
Vol. 2016, Issue DPC, 2016
January 01, 2016 EDT
Wafer-level packaging for ultra-thin glasses using hermetic room temperature welding technology
Heidi Lundén
,
Antti Peltonen
,
Antti Määttänen
,
ultra-thin glass
hermetic
room temperature
•
https://doi.org/10.4071/2016DPC-THA44
IMAPSource Conference Papers
Lundén, Heidi, Antti Peltonen, and Antti Määttänen. 2016. “Wafer-Level Packaging for Ultra-Thin Glasses Using Hermetic Room Temperature Welding Technology.”
IMAPSource Proceedings
2016 (DPC): 2203–21.
https://doi.org/10.4071/2016DPC-THA44
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats