Vol. 2016, Issue DPC, 2016January 01, 2016 EDT
Wafer-level packaging for ultra-thin glasses using hermetic room temperature welding technology
Wafer-level packaging for ultra-thin glasses using hermetic room temperature welding technology
Lundén, Heidi, Antti Peltonen, and Antti Määttänen. 2016. “Wafer-Level Packaging for Ultra-Thin Glasses Using Hermetic Room Temperature Welding Technology.” IMAPSource Proceedings 2016 (DPC): 2203–21. https://doi.org/10.4071/2016DPC-THA44.
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