Vol. 2016, Issue DPC, 2016January 01, 2016 EDT
Extending WLCSP Packaging Technology Capabilities to Enable Miniaturized Sensor and MEMS Packaging Applications
Extending WLCSP Packaging Technology Capabilities to Enable Miniaturized Sensor and MEMS Packaging Applications
Ted Tessier,
Tessier, Ted. 2016. “Extending WLCSP Packaging Technology Capabilities to Enable Miniaturized Sensor and MEMS Packaging Applications.” IMAPSource Proceedings 2016 (DPC): 397–420. https://doi.org/10.4071/2016DPC-TA23.